Congratulations to Prof. Guoqi (Kouchi) Zhang for receiving the IEEE Rao R. Tummala Electronics Packaging Award.

 

Prof. Guoqi (Kouchi) Zhang of Delft University is the Co-chair of ISA Board of Advisors together with Prof. Shuji Nakamura.   

We would like to take this opportunity to express our gratitude to Prof. Guoqi Zhang for his long-standing efforts, contribution and leadership to ISA development since its establishment, and his excellent achievements on electronics packaging, codesigning, and reliability.  

Details about awarding

 

2023 Recipient of the IEEE Rao R. Tummala Electronics Packaging Award

Guoqi (Kouchi) Zhang

“For scientific and technological leadership in “More than Moore” (MtM) packaging, codesigning, and reliability."

Prof. Zhang made outstanding technical contributions to More than Moore (MtM) packaging, co-designing, and reliability. His technical achievements enabled many key applications including energy saving via LED packaging, IoE via sensor packages, 5G via AiP, and much more. He is one of the persistent leaders of developing co-designing methods that lays down the foundation for designing for reliability, lifetime diagnostics and prognostics, virtual prototyping/qualification, and digital twin of packaging. Zhang developed an accelerated test method for LED systems that substantially reduced testing time. His accelerated test method opened the way to commercialization of LED technology and has been a key technology in reducing global energy consumption. An IEEE Fellow, Zhang is a chair professor at Delft University of Technology, Delft, the Netherlands.

 

Background of the Award

The IEEE Rao R. Tummala Electronics Packaging Award was established in 2002 and renamed in 2020 in honor of Professor Tummala.

Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.

 

Sponsor: IEEE Electronics Packaging Society

Presented to: An individual or a team of not more than three

Scope: For meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies

Prize: The award consists of a bronze medal, certificate, and honorarium.

Basis for judging: In the evaluation process, the following criteria are considered: enhancement of technology, impact on the relevant technical community and the profession, benefit to society, and the quality of the nomination. The technical field for this award includes all aspects of device and systems packaging, including packaging of microelectronics, optoelectronics, RF/wireless, and micro-electro-mechanical systems (MEMS.)

Nomination deadline: 15 January

Presentation: Typically presented at the annual Electronic Components and Technology Conference (ECTC)

The following criteria are reviewed when selecting a recipient:

• Leadership in field

• Breadth of work

• Achievement in other fields

• Inventive value (patents)

• Individual vs. group contribution

• Publications (articles, etc.)

• Originality of contribution

• Quality of nomination

• IEEE Society activities and honors

• Quality of endorsements

 

Awarding details: https://eps.ieee.org/awards/ieee-eps-technical-field-award.html